Semiconductor - BOWAY Alloy
Semiconductor
boway

Semiconductor

Boway Alloy delivers high-performance copper alloy solutions for the semiconductor industry, supporting advanced packaging technologies including lead frames, CPU sockets, and high-power IGBT components. As semiconductor packaging evolves toward smaller, lighter, and thinner designs, our materials provide the strength, conductivity, and thermal stability required for next-generation applications.

boway

Application Scenarios

Lead Frame

  • As semiconductor packaging evolves toward smaller, lighter and thinner designs, Boway etching materials offer high strength, resistance to high-temperature softening, uniform surface morphology, and excellent electroplating performance. A specialized manufacturing process ensures outstanding flatness and uniformly distributed internal stress.
  • In terms of surface quality, Boway has standardized the etched surface grade LFX 5-2-5 Rule for lead frame applications.
  • Through the etching process, pin density per unit area can be increased.

Product Datasheet

Boway Alloy
UNSENJISGB
Datasheet
boway 19400
C19400CuFe2PC1940TFe2.5
boway 70250
C70250CuNi3SiMgC7025BSi3.2-0.7

CPU Socket

  • Boway ultra-thin, high-strength materials feature ultra-high strength with excellent electrical and thermal conductivity. High-temperature resistance and superior bending performance meet the design requirements for CPU socket miniaturization, thinner profiles, and higher pin counts.
  • The material ensures stable signal transmission, highly reliable operation, and larger current carrying capacity, effectively solving the challenge of efficient chip interconnection.

Product Datasheet

Boway Alloy
UNSENJISGB
Datasheets Download
boway 70318
C70318CuNi3CoSi--

IGBT High-Power Components

  • Boway high-purity, high-conductivity materials offer excellent electrical conductivity and superior heat dissipation performance, with no risk of hydrogen embrittlement — making them suitable for high-temperature processing environments such as soldering and brazing, as well as high-voltage applications.
  • These materials are critical components for IGBT (Insulated Gate Bipolar Transistor) modules used in new energy vehicle motor controllers, on-board chargers, heaters, and compressors.